The curing time of wood floor glue is influenced by multiple factors, and the application pace must be carefully adjusted based on environmental conditions, glue properties, and operating procedures. Temperature is the primary variable. High temperatures accelerate the movement of glue molecules, shortening the curing cycle. However, excessively high temperatures can cause brittleness or weaken the bond strength. Low temperatures hinder molecular chain movement, resulting in insufficient crosslinking density and even incomplete curing. Therefore, the application temperature should be set according to the glue's instructions. For example, epoxy resin glue typically requires a temperature range of 15°C to 30°C. In winter, this can be increased with floor heating or a hot air blower, while in summer, application should be avoided during high temperatures.
Humidity has a particularly significant impact on moisture-curing wood floor glue. This type of glue relies on moisture in the air for polymerization, and higher humidity results in faster curing. However, excessive humidity can cause the glue layer to absorb water and expand, leading to deformation of the floor. Excessive humidity can lead to incomplete curing due to insufficient moisture. Before application, check the ambient humidity. If it exceeds the standard, use a dehumidifier to reduce it. If it is insufficient, spray the floor lightly with water, but ensure there is no accumulated water on the surface.
Glue type and formulation directly influence curing characteristics. Instant adhesives cure via moisture, and while initial setting may take only seconds, full curing can take several hours. Two-component epoxy adhesives require a precise mix and reaction, and their curing time is significantly affected by temperature. Hot melt adhesives cure by melting under heat and then cooling, requiring application coordination with heating equipment. When choosing an adhesive, consider the project schedule, flooring material, and environmental conditions. For example, for solid wood floors, a polyurethane adhesive with good elasticity is recommended, while for laminate floors, a quick-drying epoxy adhesive is recommended.
Glue thickness and coating uniformity are key factors in controlling the curing process. Too thick a layer of adhesive will hinder internal moisture evaporation, prolonging the curing time and even causing bulging. Too thin a layer of adhesive can lead to delamination due to insufficient bonding area. During application, use a dedicated scraper to control the amount of adhesive, for example, between 150g and 250g per square meter. Ensure even application to avoid accumulation. For highly absorbent cork floors, wipe the floor with a damp cloth beforehand to slow glue absorption and extend the working time.
Substrate properties and surface treatment affect glue penetration and bonding. Porous materials like cork require a larger amount of glue to ensure a full filler, while smooth materials like ceramic tile require sanding to enhance adhesion. Before application, clean the substrate surface to remove oil, dust, and old glue residue, for example by wiping with alcohol or a specialized cleaner. Ensure the surface is dry and free of loose soil. If the substrate moisture content is too high, reduce it to a reasonable level through ventilation or heating to prevent bubbling of the wood floor glue due to evaporation.
The application pace should be dynamically adjusted during the curing phase. During the initial curing phase, splicing should be completed quickly to prevent filming on the adhesive surface, which can cause false adhesion. During the final curing phase, maintain a stable environment to avoid vibration and heavy pressure. For example, avoid walking on epoxy glue within 48 hours after application, and avoid placing heavy objects on it within 7 days. For large-scale applications, work in sections, cleaning excess glue and inspecting the bonding quality immediately after completing each area to prevent localized issues from impacting the overall progress.
Auxiliary measures can further optimize curing. Using an accelerator can speed up the curing of anaerobic adhesives. For example, applying an accelerator to an inert metal surface can shorten the curing time by over 50%. Using cardboard as a glue stopper prevents glue spillage, reducing post-cleanup efforts. Beveled wood floor glue nozzles precisely control the amount of glue dispensed, minimizing waste. After application, a comprehensive inspection is required. Verify by hand that the adhesive is tack-free and tap the surface to confirm the presence of hollows, ensuring that the cure quality meets standards.
